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Senior Physical Design Engineering Lead

San Jose, CA
Pay
$500,000 per year
Benefits
Health, dental and vision insurance, life and disability insurance, FSA and HSA, 401(k) match, ESPP
Experience
10+ years in physical design or STA, EDA tools and flows, multiple tape-outs, programming or scripting
Number of Openings
2

Senior Physical Design Engineering Lead

Lead customer ASIC programs with about 80% hands-on work and 20% technical leadership, including physical design validation, EDA best practices, and risk mitigation. Requires 10+ years, physical design or STA, multiple tape-outs, scripting, and U.S. work authorization.

Principal and Master Physical Design Engineering Leads (2 Openings)

Total packages: $500,000 to $800,000 (Base + Bonus + Stock)

Locations: Sillicon Valley, CA

The Role / Responsibilities

As a senior technical leader, (NOTE: prior leadership experience NOT required) you will guide customer ASIC programs and ensure successful delivery of highly complex designs. (Approximately 80% hands on, 20% technical leadership).

Top Reasons to Work With Us

Join the best and brightest in the field: lead complex customer engagements and influence next-generation chip development, tackling the industry's most challenging ASIC challenges and powering tomorrow's AI and high-performance computing systems.

Your responsibilities will include:

  • Driving end-to-end customer ASIC programs: RFQs, technology planning, IP integration, design, test, packaging, fabrication, bring-up, and production
  • Managing physical design validation flows to ensure incoming customer netlists meet strict tape-out quality requirements
  • Hosting informative sessions with technical experts and advising customer teams on EDA best practices, design flows, and methodologies
  • Identifying risks related to quality, schedule, or dependencies and coordinating mitigation plans with internal and external teams

Essential Skills Over 10+ Years of Experience:

  • Hands-on experience in physical design or STA, along with EDA tools and flows covering physical design, logic simulation, test, and packaging
  • Multiple tape-outs at advanced process nodes
  • Ability to analyze PPA tradeoffs across library components, architectures, and implementation strategies
  • Thorough understanding of low power design techniques and power management
  • Programming or scripting experience
  • Excellent communication skills

A Plus if you Have:

  • Exposure to SERDES communication protocols
  • Experience in logic design, chip architecture, microarchitecture, Verilog RTL development, front-end verification, DRC, and logic synthesis
  • Knowledge of DFT methods including scan, memory BIST, and repair

 

 

Experience
10+ years in physical design or STA, EDA tools and flows, multiple tape-outs, programming or scripting
Number of Openings
2

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