Senior Power Electronics Packaging Engineer
Senior Power Electronics Packaging Engineer
Designs and develops power electronics packaging, including thermal and stress simulation, wire bonding, lead frame, and clip design. Requires 5+ years’ experience, a master’s degree or PhD preferred, SolidWorks, AutoCAD, ANSYS, and U.S. work authorization without sponsorship.
Job Title: Senior Power Electronics Packaging Engineer
Location: Sunnyvale, CA - relocation assistance offered!
Compensation: $170K - $220K base plus bonus and equity
Requirement: Power Electronics Packaging Design, Thermal & Stress Simulation (ANSYS), AutoCAD/Solidworks, MOSFETs / IGBTs, SiC/GaN/Si Devices
Position Overview
We are seeking a highly skilled Senior Power Electronics Packaging Engineer to join our dynamic team. This role involves the design and development of advanced packaging solutions for power electronics, with a focus on reliability, performance, and manufacturability. The ideal candidate will leverage their expertise in packaging design and thermal management to drive innovation in our product offerings.
Key Responsibilities
- Design and develop packaging solutions for power electronics components, ensuring optimal performance and reliability.
- Conduct thermal and stress simulations to validate packaging designs and optimize thermal management.
- Collaborate with cross-functional teams including R&D, manufacturing, and quality assurance to streamline the development process.
- Utilize advanced tools such as SolidWorks and AutoCAD for designing and modeling packaging structures.
- Perform wire bonding, lead frame, and clip design to enhance packaging efficiency.
- Oversee assembly processes and ensure adherence to best practices in packaging design and manufacturing.
- Evaluate and implement new materials and technologies, including SiC and GaN, to improve packaging performance.
Qualifications
- Master's degree (PhD preferred) in Electrical Engineering, Mechanical Engineering, or a related field.
- Minimum of 5+ years of experience in power electronics packaging design.
- Proficiency in SolidWorks and AutoCAD for 3D modeling and design work.
- Experience with thermal simulation and stress analysis, using tools like ANSYS.
- Familiarity with wire bonding, MIS substrates, assembly processes, and packaging technologies.
- Strong problem-solving skills and the ability to work collaboratively in a team environment.
Benefits
- Vacation/PTO
- Medical/Dental/Vision
- 401k w/ match
- Bonus plan
- ESPP
- Relocation
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, age, sexual orientation, gender identity or expression, national origin, ancestry, citizenship, genetic information, registered domestic partner status, marital status, status as a crime victim, disability, protected veteran status, or any other characteristic protected by law. Our hiring process includes AI screening for keywords and minimum qualifications, and a virtual recruiter as part of the application process. A human recruiter reviews all results. Click here for details on our virtual recruiter . Everforth CyberCoders will consider qualified applicants with criminal histories in a manner consistent with the requirements of applicable state and local law, including but not limited to the Los Angeles County Fair Chance Ordinance, the San Francisco Fair Chance Ordinance, and the California Fair Chance Act. Everforth CyberCoders is committed to working with and providing reasonable accommodation to individuals with physical and mental disabilities. Individuals needing special assistance or an accommodation while seeking employment can contact a member of our Human Resources team at Benefits@CyberCoders.com to make arrangements.
Salary
$170000 - $220000 USD per year